GYEON Q²M Compound Plus
Heavy Cut Compound
Experience unparalleled efficiency with GYEON Q²M Compound+, a high-performance heavy cut compound designed for powerful scratch removal with minimal dust and secondary defects. Its water-based formula, enriched with high-quality Japanese abrasives, maximizes cutting power while simplifying pre-coating prep and polish removal. Although it may leave light holograms, a single pass of Q²M Polish effortlessly refines the finish, offering a balanced blend of abrasion and finesse for professional results.
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Heavy Cut Compound with Minimal Secondary Defects
The Gyeon Q²M Compound+ stands out as a heavy cut compound renowned for its powerful scratch removal capabilities and high level of abrasion. Despite its effectiveness, it generates a low amount of dust and minimal secondary defects. It does leave behind light holograms, but these can be easily eliminated with a single pass of Q²M Polish.
Unlike typical cutting polishes, Q²M Compound+ features a water-based formula. To achieve the best results, it is essential to reduce both the speed and temperature during application. It is recommended to work in small sections and move the machine slowly across the surface.
Key Details
- Consumption: 15-40ml/panel
- Cut: ★★★★★★
- Finish: ★★★★
Q²M Compound+ is designed to provide increased cutting power without the usual downside of significant defects. Its water-based formula includes high-quality Japanese abrasives, facilitating the fast and easy removal of severe defects. The absence of silicone or fillers in the compound makes the pre-coating preparation and polish removal processes significantly quicker and simpler.
